Newly Developed Fully Automatic Polishing Machines for Obtainable Super-Smooth Surfaces of Compound Semiconductor Wafers-Reference-Cited by-同舟云学术

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Newly Developed Fully Automatic Polishing Machines for Obtainable Super-Smooth Surfaces of Compound Semiconductor Wafers

Published:1988 Issue:1 Volume:37 Page:537-540
ISSN:0007-8506
Container-title:CIRP Annals
language:en
Short-container-title:CIRP Annals

Author:

Kasai Toshio,Matumoto Fumio,Kobayashi Akira

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference2 articles.

1. Kasai, T., Kobayashi, A., 1984, Progressive Mechanical and Chemical Polishing, The Science of Polishing, Technical Digest, OSA, TuB-B4-1 - TuB-B4-4.

2. Precision Machining of Opto-electronic Crystals;Kasai;Annals of the CIRP,1973

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries;The International Journal of Advanced Manufacturing Technology;2012-02-05

2. Polishing Technology;Manufacturing Engineering and Materials Processing;2006-11-20

3. Improvement of Pad Life in Mirror Polishing for GaAs Wafers;JSME International Journal Series C;2004

4. Ultraprecision Machining. Ultraprecision Polishing for Super Smooth Surface and Newly Proposed P-MAC Polishing.;Hyomen Kagaku;2001

5. Analysis on Lapping and Polishing Pressure Distribution;CIRP Annals;1998

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