Ion-assisted selective deposition of aluminium for via-hole interconnections

Author:

Barklund AM,Berg S,Katardjiev IV,Nender C,Carlsson P

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Review Article: Tracing the recorded history of thin-film sputter deposition: From the 1800s to 2017;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2017-09

2. A novel method to determine the ion sputter coefficient of dilute segregating impurities;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2001-09

3. Preferential sputtering effects in thin film processing;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;1999-07

4. Compositional variations of sputter deposited Ti/W barrier layers on substrates with pronounced surface topography;Thin Solid Films;1999-07

5. Resputtering effects during ion beam assisted deposition and the sputter yield amplification effect;Surface and Coatings Technology;1996-10

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