Rheological, thermal conductivity, and microscopic studies on porous-structured noodles for shortened cooking time
Author:
Funder
Basic Science Research Program
National Research Foundation of Korea (NRF)
Ministry of Science, ICT and future Planning
Publisher
Elsevier BV
Subject
Food Science
Reference20 articles.
1. Official methods of analysis of AOAC international;AOAC,2005
2. Functional characterization of extruded rice noodles with corn bran: Xanthophyll content and rheology;Baek;Journal of Cereal Science,2014
3. The RVA handbook;Crosbie,2007
4. The influence of emulsifiers on the rheological properties of wheat flour dough and quality of fried instant noodles;Ding;LWT-Food Science and Technology,2013
5. Effect of low molecular weight dextrins on gelatinization and retrogradation of starch;Durán;European Food Research and Technology,2001
Cited by 34 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effects of ball milling treated wheat flour and maltodextrin on the texture and oil absorption properties of fried batter-coated cashews and almonds;Food Chemistry;2024-12
2. Comparing cooking qualities, microstructure, and sodium distribution of air-dried guar gum-coated yellow alkaline noodles with and without salt application;LWT;2024-07
3. Explaining the improving effect of dough crumb–sheet composite rolling on fresh noodle quality: From microstructure and moisture distribution perspective;Journal of Texture Studies;2024-05-04
4. A starch digestion model considering intrinsic granular properties;Journal of Food Engineering;2024-05
5. Preparation of porous-structured flat potato starch noodles with gelatin for shortening cooking time;Food Hydrocolloids;2024-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3