The interface of fluorinated amorphous carbon with copper metallization-Reference-Cited by-同舟云学术

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The interface of fluorinated amorphous carbon with copper metallization

Published:2001-04 Issue:1 Volume:302 Page:26-30
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Ariel N.,Eizenberg M.,Wang Y.,Bakhru H.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference17 articles.

1. Proc. of Advanced Metallization;Dahm,1998

2. On Advanced Interconnect Using Low Dielectric Constant Materials as Inter-Level Dielectrics

3. Semiconductor International;Peters,1998

4. Semiconductor International;Singer,1996

5. High-Resolution-Electron-Microscopy Investigation of Nanosize Inclusions

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1. Synthesis and Characterization of a Fluorinated Phenolic Resin/phenolic Resin Blend;Journal of Macromolecular Science, Part B;2015-12-08

2. Composition and chemical structure of ultra-thin a-C:F films deposited by RF magnetron sputtering with high pulsed bias;Diamond and Related Materials;2007-08

3. Processing and Characterization of Fluorinated Amorphous Carbon Low-Dielectric-Constant Films;Journal of The Electrochemical Society;2004

4. Chemical vapor deposition of C-F low-k materials;Interlayer Dielectrics for Semiconductor Technologies;2003

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