A simple passive-alignment packaging technique for laser diode modules

Author:

Wang S.C.,Chi S.,Cheng W.H.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference8 articles.

1. Lens-coupled laser diode module integrated on silicon platform;Nakagawa;J. Lightwave Technol.,1996

2. A surface mount single-mode laser module using passive alignment;Kurate;IEEE Trans. Components Packaging Manufacturing Technol. Part B,1996

3. Hybrid integration of spot-size converted laser diode on planar lightwave circuit platform by passive alignment technique;Hashimoto;Photonics Technol. Lett.,1996

4. Plastic packaging of semiconductor laser diodes;Fukuda,1996

5. Screen printed adhesive technologies for all-silicon optical packaging;Sasaki,1996

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3. Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering;Journal of Electronic Packaging;2008-02-12

4. Prediction of stand-off height and 3D shape of solder joint in fiber attachment soldering;Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)

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