Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach

Published:2022-05 Issue: Volume:149 Page:111713
ISSN:0025-5408
Container-title:Materials Research Bulletin
language:en
Short-container-title:Materials Research Bulletin

Author:

Wang Jianhao,Liu Xunda,Huo Fupeng,Kariya Kento,Masago Noriyuki,Nishikawa Hiroshi

Funder

Nanjing University of Aeronautics and Astronautics

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference48 articles.

1. Strength of joints produced by transient liquid phase bonding in the Cu–Sn system;Bosco;Acta Mater.,2005

2. The reliability of lead-free solder joint subjected to special environment: a review;Wang;J. Mater. Sci. Mater. Electron.,2019

3. Maximum junction temperatures of SiC power devices;Sheng;IEEE T. Electron. Dev.,2009

4. Recent advances on dielectrics technology for SiC and GaN power devices;Roccaforte;Appl. Surf. Sci.,2014

5. Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking;Wang;J. Mater. Sci. Mater. Electron.,2020

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Transient liquid phase bonding method of SnIn for high-temperature packaging;Journal of Materials Science: Materials in Electronics;2024-07

2. Solid-phase transient soldering method based on Au/Ni–W multilayer thin-film-modified copper-based structures;Heliyon;2024-06

3. Ultrasonic-enhanced silver‑indium transient liquid phase bonding in advancing rapid and low-temperature packaging;Materials Characterization;2024-04

4. Novel Ag-Cu foam sheet with multi-layer composite structure for high performance joining of SiC power chips;Materials Characterization;2024-03

5. Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices;ACS Applied Electronic Materials;2024-02-28

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3