Three-dimensional (3D) microstructural characterization and quantification of reflow porosity in Sn-rich alloy/copper joints by X-ray tomography
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference7 articles.
1. Effect of voids on the reliability of BGA/CSP solder joints
2. Annu IEEE Semicond Therm Meas Manage Symp;Zhu,1999
3. Effects of preexisting voids on electromigration failure of flip chip solder bumps
4. Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints
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