Microstructural study of transient liquid phase bonded DD98 and K465 superalloys at high temperature-Reference-Cited by-同舟云学术

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Microstructural study of transient liquid phase bonded DD98 and K465 superalloys at high temperature

Published:2011-05 Issue:5 Volume:62 Page:545-553
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Liu Ji-de,Jin Tao,Zhao Nai-ren,Wang Zhi-hui,Sun Xiao-feng,Guan Heng-rong,Hu Zhuang-qi

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference16 articles.

1. Activated diffusion bonding;Hoopin;Weld J,1970

2. TLP bonding: a new method for joining heat resistant alloys;Duvall;Weld J,1974

3. Formation of eutectic-type microconstituent during transient liquid phase bonding of nickel: influence of process parameters;Abdelfatah;Mater Sci Technol,2009

4. A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint;Tuah-Poku;Metall Mater Trans A,1988

5. Bulk-alloy microstructural analogues for transient liquid-phase bonds in the NiAl/Cu/Ni system;Gale;Metall Mater Trans A,1999

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