1. Scaling effect of interfacial reaction on intermetallic compound formation in Sn/cu pillar down to 1 μm diameter;Liu;Acta Mater.,2016
2. Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps;Wang;J. Mater. Sci. Mater. Electron.,2018
3. Side wall wetting induced void formation due to small solder volume in microbumps of Ni/SnAg/Ni upon reflow;Liang;ECS Solid State Lett.,2012
4. Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process;Tang;J. Alloys Compd.,2019
5. Vertical interconnects of microbumps in 3D integration;Chen;MRS Bull.,2015