Study on the metallurgical reaction law and mechanism of the Ni-xCu alloys/pure Sn solid-liquid interface
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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3. Self-Formed Reaction Barrier of (Cu,Ni)6sn5 Intermetallic Compound on Ni-35cu Under Bump Metallization;2024
4. Accelerated Solid-Liquid Interdiffusion Bonding of Cu Joint Using a Cu10ni Alloy Mesh Reinforced Sac305 Composite Solder;2023
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