Microstructure and hot deformation behavior of the Cu-Sn-Ni-Zn-Ti(-Y) alloy-Reference-Cited by-同舟云学术

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Microstructure and hot deformation behavior of the Cu-Sn-Ni-Zn-Ti(-Y) alloy

Published:2023-02 Issue: Volume:196 Page:112559
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Xu Deye,Zhou Meng,Zhang Yi,Tang Shunlong,Zhang Zhiyang,Liu Yong,Tian Baohong,Li Xu,Jia Yanlin,Volinsky Alex A.,Li De,Liu Qiujie

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference42 articles.

1. Effects of strain rates on dynamic deformation behavior of Cu-20Ag alloy;Song;J. Mater. Sci. Technol.,2021

2. Constitutive modeling of hot deformation behavior of vacuum hot pressed Cu-8Cr-4Nb alloy;Shukla;Mater. Design,2015

3. Microstructure evolution and properties of a quaternary Cu–Ni–Co–Si alloy with high strength and conductivity;Li;Mater. Sci. Eng. A,2019

4. High electrical conductive copper matrix composites reinforced with LaB6–TiB2 eutectic particles;Solodkyi;Vacuum.,2020

5. EBSD analysis of hot deformation behavior of cu-Ni-co-Si-Cr alloy;Ban;Mater. Charact.,2020

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1. Hot deformation behavior of 30MnB5V steel: Phenomenological constitutive model, ensemble learning algorithm, hot processing map and microstructure evolution;Journal of Materials Research and Technology;2024-09

2. Effects of Y2O3 on the hot deformation behavior and microstructure evolution of Al2O3-cu/35Cr3TiB2 electrical contact composites;Materials Characterization;2024-09

3. Hot deformation behavior and microstructure evolution of the Cu-1.5Ti-(0.5Fe) alloys;Journal of Materials Research and Technology;2024-05

4. Tailoring the microstructure, mechanical properties, and electrical conductivity of Cu–0.7Mg alloy via Ca addition, heat treatment, and severe plastic deformation;Archives of Civil and Mechanical Engineering;2024-03-10

5. Unveiling the Room-Temperature Softening Phenomenon and Texture Evolution in Room-Temperature-Rolled Cu–0.13Sn Alloys;Metallurgical and Materials Transactions A;2024-03-04

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