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Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization

  • Published:2022-07 Issue: Volume:19 Page:2510-2515
  • ISSN:2238-7854
  • Container-title:Journal of Materials Research and Technology
  • language:en
  • Short-container-title:Journal of Materials Research and Technology

Author:

Tsai Chin-Hao,Hung Han-Tang,Chang Fu-Ling,Bickel Steffen,Müller Maik,Panchenko Iuliana,Bock Karlheinz,Kao C.R.

Funder

Deutscher Akademischer Austauschdienst

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference10 articles.

1. Wearable electronics and smart textiles: a critical review;Stoppa;Sensors,2014

2. Advanced wafer level technology: enabling innovations in mobile, IoT and wearable electronics;Yoon,2015

3. Lead-free solders in microelectronics;Abtew;Mater Sci Eng R Rep,2000

4. Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing;Hung;J Mater Res Technol,2020

5. Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test;Date;Scripta Mater,2004
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