Relationship between microstructure and etching performance of 12 μm thick rolled copper foil
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference53 articles.
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3. Effect of post-annealing on the microstructure and mechanical properties of nanostructured copper;Afifeh;Mater Sci Eng, A,2021
4. Impact of plasma etching on fabrication technology of liquid crystal polyer printed circuit board [J];Yung;J Mater Sci-Mater El,2010
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