Microstructural response of copper foil to a novel double-cross rolling process
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference28 articles.
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1. Effects of Cold Rolling Path on Recrystallization Behavior and Mechanical Properties of Pure Copper During Annealing;2024
2. Effect of dislocation and residual stress on etching performance of 12 μm thick rolled copper foil during pre-stretching;Materials Characterization;2023-11
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4. Relationship between microstructure and etching performance of 12 μm thick rolled copper foil;Journal of Materials Research and Technology;2022-11
5. Softened Microstructure and Properties of 12 μm Thick Rolled Copper Foil;Materials;2022-03-18
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