Interfacial IMC evolution and shear strength of MWCNTs-reinforced Sn–5Sb composite solder joints: Experimental characterization and artificial neural network modelling-Reference-Cited by-同舟云学术

Interfacial IMC evolution and shear strength of MWCNTs-reinforced Sn–5Sb composite solder joints: Experimental characterization and artificial neural network modelling

Published:2021-07 Issue: Volume:13 Page:1020-1031
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Dele-Afolabi T.T.,Azmah Hanim M.A.,Ojo-Kupoluyi O.J.,Jung D.W.,Nuraini A.A.,Erameh A.A.

Funder

Universiti Putra Malaysia

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference40 articles.

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3. Creep life prediction for Sn-5Sb lead-free solder alloy: model and experiment;Vafaeenezhad;Microelectron Eng,2019

4. Effect of Zn and Sb additions on the impression creep behavior of lead-free Sn-3.5 Ag solder alloy;Pourmajidian;J Electron Mater,2016

5. Recent progress on the development of Sn–Bi based low-temperature Pb-free solders;Wang;J Mater Sci Mater Electron,2019

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4. Synergistic effect of MWCNT addition on the thermal and elastic properties of Sn–5Sb–0.3Cu alloy;Journal of Materials Science: Materials in Electronics;2023-12

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