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Thermal response of active Si in press-fit rectifier diodes by confocal Raman microscopy: Influence of diode design and technology

  • Published:2022-05 Issue: Volume:18 Page:2570-2581
  • ISSN:2238-7854
  • Container-title:Journal of Materials Research and Technology
  • language:en
  • Short-container-title:Journal of Materials Research and Technology

Author:

Román-Sánchez S.ORCID,Serrano A.ORCID,del Campo A.,Lorite I.,Fernández J.F.ORCID,Moure A.ORCID

Funder

Ministerio de Economía y Competitividad

European Social Fund

Comunidad de Madrid

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference33 articles.

1. Solder joint reliability in alternator power diode assemblies;Pan;J Electron Mater,1999

2. Thermal expansion mismatch in electronic packaging;Carlson;Mater Res Soc Symp Proc,1985

3. Analysis of automotive lead-acid batteries exchange rate on the base of field data acquisition;Murken,2018

4. Thermal imaging and measurement techniques for electronic materials and devices;Kölzer;Microelectron Eng,1996

5. Mechanical stress measurement electronics based on piezo-resistive and piezo-hall effects;Magnani;Proc IEEE Int Conf Electron Circuits Syst,2002
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