Enhancing interfacial bond strength between PEEK and inkjet-printed silver film through laser surface modification for additive manufacturing of electronics-Reference-Cited by-同舟云学术

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Enhancing interfacial bond strength between PEEK and inkjet-printed silver film through laser surface modification for additive manufacturing of electronics

Published:2024-05 Issue: Volume:30 Page:6724-6736
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Liu Qingtao^ORCID,Wei Dongjie,Lv Jingxiang,Wang Zijun,Xu Zhiguang,Yang Pengtao,Zhang Yichao,Li Chao

Funder

Xi'an Science and Technology Bureau

Ministry of Science and Technology of the People's Republic of China

Publisher

Elsevier BV

Reference46 articles.

1. Flexible antennas: a review;Kirtania;Micromachines,2020

2. Additive manufacturing of polymer nanocomposites: needs and challenges in materials, processes, and applications;Al Rashid;J Mater Res Technol,2021

3. Inkjet-printed flexible reconfigurable antenna for conformal WLAN/WiMAX wireless devices;Saeed;IEEE Antenn Wireless Propag Lett,2016

4. Approaches for additive manufacturing of 3D electronic applications;Hoerber;Procedia CIRP,2014

5. Multi-material additive manufacturing of electronics components: a bibliometric analysis;Dzogbewu;Resul Eng,2023

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