1. Franke J, editor. Raeumliche elektronische Baugruppen (3D-MID): Werk- stoffe, Herstellung, Montage und Anwendungen für spritzgegossene Schaltungstraeger (eng.: Molded Interconnect Devices 3D-MID: Materials, Manufacturing, Assembly and Applications for Molded Circuit Carriers). Munich: Carl Hanser Verlag; 2013.
2. Gebhardt A. Generative Fertigungsverfahren, Rapid Prototyping – Rapid Tooling – Rapid Manufacturing (eng.: Generative Manufacturing Processes, Rapid Prototyping – Rapid Tooling – Rapid Manufacturing). Munich: Carl Hanser Verlag; 2007.
3. Zaeh MF, Glasschroeder J, Krol T, Schilp J. Innovative Loesungen zur Steigerung der Bauteilqualitaet bei additiven Fertigungsverfahren (eng.: Innovative Solutions for Increasing the Quality of Components at Additive Maufacturing Processes). Munich: Utz Verlag; 2011.
4. Gibbson I, Rosen DW, Stucker B. “Additive Manufacturing Technologies, Rapid Prototyping to Direct Digital Manufacturing. New York: Springer; 2010.
5. Organic Electronics Association editor. Whitepaper – OE-A Roadmap for Organic and Printed Electronics, 4th Edition, Frankfurt, 2011.