Thermal analysis of solid-state devices and circuits: an analytical approach
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference28 articles.
1. Computer simulation of integrated circuits in the presence of electrothermal interaction
2. Thermal design and simulation of bipolar integrated circuits
3. Thermal modeling and experimental techniques for microwave bipolar devices
4. Székely V, Rencz M, Courtois B. IEEE Des Test Comp 1998;14
Cited by 36 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Self-heating Effects on Power Loss of SiC-Based General-Purpose Inverter-Stack Circuit;Lecture Notes in Electrical Engineering;2023
2. Experimental Determination, Modeling, and Simulation of Nonlinear Thermal Effects in Bipolar Transistors under Static Conditions: A Critical Review and Update;Energies;2022-07-28
3. Interconnect effects on thermal resistance of CMOS-SOI transistors in microwave power integrated circuits;Solid-State Electronics;2021-12
4. Application of an exact integral transform formulation for temperature estimation in solid-state electronics;Journal of the Brazilian Society of Mechanical Sciences and Engineering;2021-03-17
5. Thermal characterization of GaN lateral power HEMTs on Si, SOI, and poly-AlN substrates;Microelectronics Reliability;2021-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3