Author:
Gao W.,Gong H.,He J.,Thomas A.,Chan L.,Li S.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. A copper/polyimide Metal-base packaging technology
2. The Future of Interconnects, Solid State Technology, Feb. 1998.
3. Oxidation and reduction of copper oxide thin films
4. Oxidation of Metals and Alloys;Kubaschuwski,1962
Cited by
54 articles.
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