Bonding of silicon nitride ceramics using Fe–Ni/Cu/Ni/Cu/Fe–Ni interlayers
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference10 articles.
1. Joining of Si3N4 using Ag57Cu38Ti5 brazing filler metal
2. Partial transient liquid-phase metals layer technique of ceramic-metal bonding
3. Joining of silicon nitride via a transient liquid
4. The influence of brazing conditions on joint strength in Al2O3/Al2O3 bonding
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3. Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint;Metals;2016-09-15
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