Surface studies of interconnecting zones for selective-area sealing of hybrid microcircuits using isothermal solidification process-Reference-Cited by-同舟云学术

Surface studies of interconnecting zones for selective-area sealing of hybrid microcircuits using isothermal solidification process

Published:1999-08 Issue:4 Volume:40 Page:170-174
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Khanna P.K,Bhatnagar S.K,Gust W

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference5 articles.

1. H. Haas, T. Okstajner, in: Interconnection Technology in Electronics: Soldering–Welding–Glueing. Lectures and Poster Show Contributions of the 4th Int. Conf., DVS-Verlag, Düsseldorf, 1988, p. 152.

2. Development of thermally stable NiAg interconnections for application to resistive films

3. Reactive isothermal solidification in the Ni–Sn system

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Stable interconnections for LTCC micro-heater using isothermal solidification technique;Soldering & Surface Mount Technology;2018-02-05

2. Design, simulation and fabrication of LTCC-based microhotplate for gas sensor applications;Microsystem Technologies;2018-01-23

3. A Novel System for Analysis of Surface Profiles from 3-D Components Using the Dickinson Rotating Ring Contact Profiler;International Journal of Surface Engineering and Interdisciplinary Materials Science;2013-01

4. Realization of High Packaging Density on Ceramics for High Temperature Applications;Integrated Ferroelectrics;2010-11-12

5. Isothermal solidification based packaging of biosensors at low temperatures;Thin Solid Films;2010-11