Author:
BOUYAGHROUMNI A,VERSAUD P,VITTORI O
Subject
Industrial and Manufacturing Engineering,Metals and Alloys
Cited by
9 articles.
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1. Electroplating of Copper in the Presence of 5,6-Dihydropyrimidine-2-(1H)-thione, 2-Methylthiopyrimidine-4-(1H)-one, 2-Thiopyrimidine-4-(1H)-ones, and 2,4-Pyrimidine(1H,3H)-dione Derivatives as Organic Additives;Journal of Dispersion Science and Technology;2011-02-22
2. Electroplating of Steel in the Presence of 5,6-Dihydropyrimidine-2-(1H)-thione, 2-Methylthiopyrimidine-4-(1H)-one, 2-Thiopyrimidine-4-(1H)-ones, and 2,4-Pyrimidine(1H,3H)-dione Derivatives as Organic Additives;Journal of Dispersion Science and Technology;2010-02-26
3. Effect of organic additives on characterization of electrodeposited Co-W thin films;Applied Surface Science;2007-07
4. Recent developments in the electrodeposition of nickel and some nickel-based alloys;Journal of Applied Electrochemistry;2006-07-14
5. Structure and Properties of Electrocodeposited Cu-Al2O3 Nanocomposite Thin Films;Journal of Engineering Materials and Technology;2005-02-22