Low Cycle Fatigue Behavior of SnAgCu Solder Joints
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference18 articles.
1. Solders in electronics
2. Effect of dwell times on thermomechanical fatigue behavior of Sn-Ag-based solder joints
3. Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
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