Effect of Ni interlayer on strength and microstructure of diffusion-bonded Mo/Cu joints-Reference-Cited by-同舟云学术

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Effect of Ni interlayer on strength and microstructure of diffusion-bonded Mo/Cu joints

Published:2012-01 Issue:1 Volume:66 Page:113-116
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Zhang Jian,Xiao Yuan,Luo Guoqiang,Shen Qiang,Zhang Lianmeng

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference14 articles.

1. Ronald S Fusco. US patent 4950554, Aug 21, 1990.

2. Richard D Nicholson, Ronald S Fusco. US patent 4957823, Sep 18, 1990.

3. Study of brazing Ti-6Al-4V and TZM alloy using pure silver

4. Feng Tao;Jiangwei;Mater Lett,2002

5. Gaio Wenzhu;Yang;J Adv mater,2003

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