Effect of reinforced multiwall carbon nanotubes on the damping characteristics of Sn-Ag-Cu lead-free solder
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference17 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Properties of lead-free solder alloys with rare earth element additions
3. Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder
4. Damping characteristics of Sn–3Ag–0.5Cu and Sn–37Pb solders studied by dynamic mechanical analysis
5. Low-frequency damping properties of eutectic Sn–Bi and In–Sn solders
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1. Enhanced Strength–Ductility Combination in Laser Welding of CrCoNi Medium-Entropy Alloy with Ultrasonic Assistance;Metals;2024-08-27
2. Electric current stressing enhanced damping properties in Sn5Sb solder;Soldering & Surface Mount Technology;2024-04-25
3. Synergistic effect of MWCNT addition on the thermal and elastic properties of Sn–5Sb–0.3Cu alloy;Journal of Materials Science: Materials in Electronics;2023-12
4. Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review;Crystals;2023-05-09
5. Elevated damping properties of lead-free solders under electric current stressing;Scripta Materialia;2023-03
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