Diffusion reaction-induced microstructure and strength evolution of Cu joints bonded with Sn-based solder containing Ni-foam
Author:
Funder
University of Sheffield
EPSRC
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference11 articles.
1. The fast formation of Cu-Sn intermetallic compound in Cu/Sn/Cu system by induction heating process
2. Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics
3. Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
4. Influence of Ni particle addition on grain refinement of Cu-Sn intermetallic compound joints bonded at various temperatures
5. Mater;Niu;Sci. Eng., A,2020
Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Interfacial reaction and strengthening mechanism of thermo-compression bonding foam Ni reinforced SAC105 and SAC105–0.3Ti solder joints;Materials Characterization;2024-09
2. Phase field simulation of interface evolution behavior of copper–tin micro-solder joints under thermal–mechanical–electrical coupling;Journal of Adhesion Science and Technology;2024-04-23
3. First-Principles Study of Cu Addition on Mechanical Properties of Ni3Sn4-Based Intermetallic Compounds;Metals;2024-01-05
4. Recent Advances in High Entropy Alloy Fillers for Brazing Similar and Dissimilar Materials: A Review;Metals and Materials International;2023-12-29
5. Effect of non-standard SnAg surface finishes on properties of solder joints;Applied Surface Science Advances;2023-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3