Author:
Xu Ting,Miao Jianmin,Ashraf Mohammed,Lin Nay,Chollet Franck
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference15 articles.
1. International Technology Roadmap for Semiconductors (Semiconductor Industry Association, San Jose, CA, 2001).
2. Bottom-up approach for carbon nanotube interconnects
3. Fundamentals of Microsystems Packaging;Tummala,2001
4. Electromigration Performance of Multi-level Damascene Copper Interconnects
5. Carbon nanotubes in interconnect applications
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