Microwave assisted low temperature encapsulation of Ag films by Cu reactions using Ag–Cu alloy structures
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference11 articles.
1. TFT-LCD technology
2. The corrosion of silver by atmospheric sulfurous gases
3. Formation of aluminum oxynitride diffusion barriers for Ag metallization
4. Enhancement of Ag electromigration resistance by a novel encapsulation process
5. Microwave Heating of Thin Au Film
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2. Electrochemical Synthesis of Nanocrystalline CuAg Coatings on Stainless Steel from Cyanide-Free Electrolyte;Processes;2022-10-20
3. One‐step synthesis of oxidation‐resistant Cu@Ag core–shell nanoparticles;Micro & Nano Letters;2018-02
4. Microwave assisted growth of copper germanide thin films at very low temperatures;Applied Physics Letters;2013-08-26
5. Structural and optical properties of Ag-doped copper oxide thin films on polyethylene napthalate substrate prepared by low temperature microwave annealing;Journal of Applied Physics;2013-06-28
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