Electrical performance and reliability evaluation of inkjet-printed Ag interconnections on paper substrates-Reference-Cited by-同舟云学术

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Electrical performance and reliability evaluation of inkjet-printed Ag interconnections on paper substrates

Published:2012-12 Issue: Volume:88 Page:68-72
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Xie Li,Mäntysalo Matti,Cabezas Ana López,Feng Yi,Jonsson Fredrik,Zheng Li-Rong

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference19 articles.

1. The Internet of Things. ITU Internet Report; 2005.

2. Smart objects as building blocks for the internet of things;Kortuem;IEEE Internet Comput,2010

3. OE-A roadmap for organic and printed electronics,2009

4. Crack formation and substrate effects on electrical resistivity of inkjet-printed Ag lines;Lee;Mater Lett,2010

5. Inkjet printed system-in-package design and manufacturing;Miettinen;Microelectr J,2008

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1. Wear reliability and failure mechanism of inkjet-printed conductors on paperboard substrate;Flexible and Printed Electronics;2023-04-24

2. Development and Optimization of 3D-Printed Flexible Electronic Coatings: A New Generation of Smart Heating Fabrics for Automobile Applications;Micromachines;2023-03-29

3. 2D characterisation and evaluation of multi-material structures towards 3D hybrid printing;Virtual and Physical Prototyping;2023-03-16

4. Advances in Inkjet‐Printed Solid Oxide Fuel Cells;Advanced Materials Technologies;2022-03-11

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