High thermal conductivity Cu-3Cr/Diamond composites fabricated by powder metallurgy
Author:
Funder
Science and Technology Program of Hunan Province
Publisher
Elsevier BV
Reference11 articles.
1. X.J mi, tailoring the thermal and mechanical properties of diamond/Cu composites by interface regulation of cr alloying;Xie;Diamond Relat. Mater.,2021
2. Unveiling the interface characteristics and their influence on the heat transfer behavior of hot-forged CueCr/Diamond composites;Jia;Carbon,2021
3. High thermal conductivity and strong interface bonding of a hot forged Cu/Ti-coated-diamond composite;Lei;Carbon,2020
4. Spark plasma sintering of titanium-coated diamond and copper–titanium powder to enhance thermal conductivity of diamond/copper composites;Che;Mater. Sci. Semicond. Process.,2015
5. Enhanced thermal conductivity of copper/diamond composites by fine-regulating microstructure of interfacial tungsten buffer layer;Sang;J. Alloys Compd.,2021
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