Evolution of Ag3Sn compound formation in Ni/Sn5Ag/Cu solder joint
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference16 articles.
1. Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structure
2. Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow
3. Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints
4. Studies of the mechanical and electrical properties of lead-free solder joints
5. Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging
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2. Enhancing mechanical properties via the dual effect of Ni addition and temperature gradient for 5 μm Cu/Sn-3.0Ag-0.5Cu/Cu transient liquid phase bonding;Materials Science and Engineering: A;2023-04
3. Influence of ceramic substrate quality on CBGA assembly reliability;Engineering Failure Analysis;2021-05
4. A high-entropy alloy as very low melting point solder for advanced electronic packaging;Materials Today Advances;2020-09
5. Interfacial transfer and phase evolution between Cu and Sn solder doped with minor Cu, Ag and Ni: experimental and theoretical investigations;Applied Physics A;2020-07-31
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