Thermal stability of intermetallic compounds at Sn-0.7Cu-10Bi-xNi/Co interface during reflows-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Thermal stability of intermetallic compounds at Sn-0.7Cu-10Bi-xNi/Co interface during reflows

Published:2019-11 Issue: Volume:254 Page:69-72
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Gao He,Wei Fuxiang,Lin Caixia,Shu Tie,Sui Yanwei,Qi Jiqiu,Zhang Xuping

Funder

the Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference14 articles.

1. Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections

2. Growth behavior of intermetallic compounds on Sn-10Bi-0.7Cu-0.15Co/Co interface under multiple reflows

3. Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

4. Nucleation, grain orientations, and microstructure of Sn-3Ag-0.5Cu soldered on cobalt substrates

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Nano-Cu6Sn5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints;Materials Characterization;2024-01

2. In-situ fusion process and Cu–Sn compounds evolution mechanism of nano-intermetallic compound mixed solder joints;Journal of Materials Research and Technology;2023-09

3. Effect of nano-intermetallic compound on creep properties and β-Sn grain recrystallization of Cu/Sn-Ag-Cu/Ni solder joints;Materials Today Communications;2023-08

4. Sn-0.7Cu-10Bi Solder Modification Strategy by Cr Addition;Metals;2022-10-21

5. Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu–xSiC solder joints;Materials Science and Engineering: A;2021-03

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3