Evaluation of conductivity in W–Cu composites through the estimation of topological microstructures-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Evaluation of conductivity in W–Cu composites through the estimation of topological microstructures

Published:2006-07 Issue:16 Volume:60 Page:2000-2003
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Lee Young Jung,Lee Byung-Hoon,Kim Gil-Su,Kim Dae-Gun,Kim Deok-Soo,Kim Young Do

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference15 articles.

1. Ultrahigh pressure consolidation (UHPC) of W-Cu composites

2. Thermal conductivity of W–Cu composites at various temperatures

3. Electronic Properties of Materials;Hummel,2001

Cited by 36 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Extraordinary ductility in the 75W–25Cu composite at elevated temperatures;Materials Science and Engineering: A;2024-09

2. Effect of Y2O3 on high temperature thermal compression performance of Cu–10W composites and microstructure analysis;Ceramics International;2024-08

3. Revealing the Mechanism of the Extraordinary Ductility in the 75w-25cu Composite at Elevated Temperatures;2024

4. Morphological Analyses of W/Cu Functional Graded Materials Obtained by Conventional and Spark Plasma Sintering;Materials;2023-06-01

5. Microstructure and properties of W-Ag matrix composites by designed dual-metal-layer coated powders;Materials & Design;2022-07

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3