Electromigration induced spontaneous Ag whisker growth in fine Ag-alloy bonding interconnects: Novel polarity effect-Reference-Cited by-同舟云学术

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Electromigration induced spontaneous Ag whisker growth in fine Ag-alloy bonding interconnects: Novel polarity effect

Published:2016-11 Issue: Volume:182 Page:55-58
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Hsu Tzu-Yu,Chang Jing-Yao,Chang Hsiao-Min,Ouyang Fan-Yi

Funder

Ministry of Science and Technology of Taiwan, R. O. C.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference16 articles.

1. Electromigration in submicron interconnect features of integrated circuits;Ceric;Mater. Sci. Eng. R,2011

2. Evolutions of bonding wires used in semiconductor electronics: perspective over 25 Years;Gan;J. Mater. Sci. – Mater. Electron.,2015

3. Thermal stability of grain structure and material properties in an annealing-twinned Ag–8Au–3Pd alloy wire;Chuang;Scr. Mater.,2012

4. Behavior of intermetallics formation and evolution in Ag–8Au–3Pd alloy wire bonds;Guo;J. Alloy. Compd.,2014

5. Effect of annealing twins on electromigration in Ag–8Au–3Pd bonding wires;Chuang;J. Electron. Mater.,2013

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1. Ag and Cu whisker formation in Ag–Cu–Te alloys;Journal of Materials Science;2024-05

2. A Review of Silver Wire Bonding Techniques;Micromachines;2023-11-20

3. Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints;Coatings;2021-08-04

4. Design and Validation of Reliability Physics for Interconnect Architectures Induced from Inclusive TM/SM/EM Effects;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

5. Electromigration Behavior of Screen-Printing Silver Nanoparticles Interconnects;JOM;2019-07-23

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