Mechanical strengthening of nanotwinned Cu films with Ag solid solution-Reference-Cited by-同舟云学术

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Mechanical strengthening of nanotwinned Cu films with Ag solid solution

Published:2022-04 Issue: Volume:313 Page:131775
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Lee Kang-Ping,Tran Dinh-Phuc,Chen Fu-Chian,Hsu Wei-You,Lin Yi-Quan,Liu Hung-Che,Chen Chih

Funder

Ministry of Education

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference35 articles.

1. G. E. Moore, McGraw-Hill New York, NY, USA, 1965.

2. Ductility of Nanostructured Materials

3. Ultrahigh Strength and High Electrical Conductivity in Copper

4. Effect of deposition temperature on mechanical properties of nanotwinned Cu fabricated by rotary electroplating

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrodeposition of Copper-Silver Alloys from Aqueous Solutions: A Prospective Process for Miscellaneous Usages;Compounds;2024-07-08

2. In situ epitaxial thickening of wafer-scale, highly oriented nanotwinned Ag on tailored polycrystalline Cu substrates;Acta Materialia;2024-04

3. High-strength and high-conductivity nanotwinned Cu lightly doped with Ni;Materials Science and Engineering: A;2024-01

4. Preparation and mechanism of Cu-GO laminated composite films with high thermal conductivity by intermediate nickel and silver layers via electrodeposition and ultrasonic spraying method;Surface and Coatings Technology;2023-11

5. The microstructure and hardness of Cu-76 at.% Ag multilayers prepared by co-deposition;Vacuum;2023-09

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