Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array

Published:2022-01 Issue: Volume:307 Page:131074
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Jiang Han,Robertson Stuart,Liang Shuibao,Zhou Zhaoxia,Zhao Liguo,Liu Changqing

Funder

China Scholarship Council

Engineering and Physical Sciences Research Council

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference17 articles.

1. Strength of joints produced by transient liquid phase bonding in the Cu–Sn system

2. Full intermetallic joints for chip stacking by using thermal gradient bonding

3. Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach

4. Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints

5. Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Soft-template-assisted bottom-up fabrication of tunable porosity monolithic copper film for interconnection in microelectronics;Journal of the Taiwan Institute of Chemical Engineers;2023-11

2. Microstructural and mechanical integrity of Cu/Cu joints formed through transient liquid bonding with Cu-Sn nanocomposite interlayer;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

3. Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite;Materials Today Communications;2022-12

4. Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer;Microelectronics Reliability;2022-11

5. Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation;Journal of Materials Research and Technology;2022-07

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3