All-wet encapsulation and electroless superfilling process for the fabrication of self-assembled-monolayer encapsulated copper interconnects with enhanced electromigration reliability-Reference-Cited by-同舟云学术

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All-wet encapsulation and electroless superfilling process for the fabrication of self-assembled-monolayer encapsulated copper interconnects with enhanced electromigration reliability

Published:2021-12 Issue: Volume:304 Page:130718
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Chen Giin-Shan,Lee Ching-En,Yang Tzu-Ming,Cheng Yi-Lung,Fang Jau-Shiung

Funder

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference24 articles.

1. The Development of Cu Filling and Reliability Performance with Ru-Ta Alloy Barrier for Cu Interconnects

2. Characteristics of an Amorphous Carbon Layer as a Diffusion Barrier for an Advanced Copper Interconnect

3. Recent Advances in Barrier Layer of Cu Interconnects

4. 30 years of electroless plating for semiconductor and polymer micro-systems

5. D.C. Edelstein. 2017. IEDM. 14.1.1−14.1.4.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reinforcement in electromigration reliability of Cu interconnects by alloying of extremely dilute MnO;Journal of Alloys and Compounds;2023-08

2. Enhancement of Electromigration Reliability of Electroless-Plated Nanoscaled Copper Interconnects by Complete Encapsulation of a 1 nm-Thin Self-Assembled Monolayer;Journal of The Electrochemical Society;2022-08-01

3. Research Progress of Electroless Plating Technology in Chip Manufacturing;Acta Chimica Sinica;2022

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