The fracture mechanism of Cu3Sn-microporous copper composite joint by thermal compression bonding process
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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2. Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging;Journal of Materials Science: Materials in Electronics;2023-03
3. The Mechanical Properties and Elastic Anisotropy of η′-Cu6Sn5 and Cu3Sn Intermetallic Compounds;Crystals;2021-12-14
4. Cu3Sn-microporous copper composite joint for high-temperature die-attach applications;Soldering & Surface Mount Technology;2021-10-04
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