Anisotropic distribution of residual strain around conical nanoindentation in silicon
Author:
Funder
National Key Technology R&D Program
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. Packaging Effect on MEMS Pressure Sensor Performance
2. Nanoscratch-induced deformation of single crystal silicon
3. Strain: A Solution for Higher Carrier Mobility in Nanoscale MOSFETs
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1. Strain states and evolutionary mechanism of microstructures at the crack tips of monocrystalline silicon;Applied Surface Science;2022-11
2. The resolution and repeatability of stress measurement by Raman and EBSD in silicon;Vacuum;2022-09
3. Strain States and Evolutionary Mechanisms of Microstructures at the Crack Tips Of Monocrystalline Silicon;SSRN Electronic Journal;2022
4. Stress analysis in scratching of anisotropic single-crystal silicon carbide;International Journal of Mechanical Sciences;2018-06
5. Stress measurement at the interface between a Si substrate and diamond-like carbon/Cr/W films by the electronic backscatter diffraction method;Applied Physics Express;2016-01-20
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