Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching-Reference-Cited by-同舟云学术

Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching

Published:2001-06 Issue:1-2 Volume:388 Page:303-314
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Filippi R.G,Gribelyuk M.A,Joseph T,Kane T,Sullivan T.D,Clevenger L.A,Costrini G,Gambino J,Iggulden R.C,Kiewra E.W,Ning X.J,Ravikumar R,Schnabel R.F,Stojakovic G,Weber S.J,Gignac L.M,Hu C.-K,Rath D.L,Rodbell K.P

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

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