Detecting, characterising and assessing PEEK’s and CF-PEEK’s thermal degradation in rapid high-temperature processing
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Polymers and Plastics,Mechanics of Materials,Condensed Matter Physics
Reference54 articles.
1. On the stability of PEEK for short processing cycles at high temperatures and oxygen-containing atmosphere;Pascual;Polym. Degrad. Stab.,2019
2. PEEK polyetheretherketone;Wypych,2016
3. Investigation of the thermal decomposition and flammability of PEEK and its carbon and glass-fibre composites;Patel;Polym. Degrad. Stab.,2011
4. PEEK composites reinforced by nano-sized SiO2 and Al2O3 particulates;Kuo;Mater. Chem. Phys.,2005
5. Highly boosting the interlaminar shear strength of CF/PEEK composites via introduction of PEKK onto activated CF;Hassan;Compos. Part A Appl. Sci.Manuf.,2018
Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Fumasep FAA-3-PK-130: Exploiting multinuclear solid-state NMR to shed light on undisclosed structural properties;Polymer;2024-10
2. An Experimental Study on the Thermomechanical Coupling Effects of Carbon-Fiber-Reinforced Polyetheretherketone under Dynamic Impact;Polymers;2024-08-14
3. Biodegradable polybutylene adipate terephthalate foams: Investigating sustainability via reprocessing and green solvent;Journal of Applied Polymer Science;2024-06-27
4. Fracture toughness and failure behavior of CF/epoxy composites interleaved with melt‐infused PET, PEI, and PEEK film;Polymer Composites;2024-06-05
5. Effect of cryogenic aging and test-environment on the tribological and mechanical properties of PEEK composites;Tribology International;2024-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3