Effects of curing conditions on structural evolution and mechanical properties of UV-curable polyurethane acrylate coatings
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Organic Chemistry,Surfaces, Coatings and Films,General Chemical Engineering
Reference38 articles.
1. Cross-border impacts of the restriction of hazardous substances: a perspective based on japanese solders;Fuse;Environ. Sci. Technol.,2013
2. Lead-free alloys;Zoran Miric;Solder. Surf. Mt. Technol.,1998
3. Minimization of tin whisker formation for lead-free electronics finishing;Schetty;Circuit World,2001
4. Annotated tin whisker bibliography and anthology;Galyon;IEEE Trans. Electron. Packag. Manuf.,2005
5. Evaluation of pure tin plated copper alloy substrates for tin whiskers;Mathew;Circuit World,2009
Cited by 35 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Enhancing flexibility and durability of PVC with liquid epoxidized natural rubber: Innovative UV treatment to mitigate plasticizer migration;Journal of Vinyl and Additive Technology;2024-08-18
2. Poorly-/well-dispersed Fe3O4: Abnormal influence on electromagnetic wave absorption behavior of high-mechanical performance polyurea;Chemical Engineering Journal;2024-08
3. Investigation to the effects of particulate-polymer fillers on the viscoelastic properties of VHB 4910 elastomer for artificial muscle;Journal of Polymer Research;2024-04
4. Curing Law and Strength-Age Prediction Model of a Dense Polyurethane Mixture under the Influence of Moisture and Temperature;Journal of Materials in Civil Engineering;2024-03
5. Research Progress on Self-Healing Polyurethane and Its Applications in the Field of Flexible Sensors;PROG CHEM;2023
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3