Minimization of tin whisker formation for lead‐free electronics finishing-Reference-Cited by-同舟云学术

Minimization of tin whisker formation for lead‐free electronics finishing

Published:2001-06 Issue:2 Volume:27 Page:17-20
ISSN:0305-6120
Container-title:Circuit World
language:en
Short-container-title:Circuit World

Author:

Schetty Rob

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference13 articles.

1. Arnold, S.M. (1954), “Metal whiskers – a factor in design”,Proceedings of The Electronic Components Symposium, p. 38.

2. Arnold, S.M. (1956),Proceedings of 43rd Annual AES Meeting.

3. Arnold, S.M. (1966),Plating, Vol. 1 No. 53, pp. 96‐9.

4. Britton, S.C. (1974),Transactions of the Institute of Metal Finishing, No. 52, pp. 95‐102.

5. Cunningham, K.M. and Donahue, M.P. (1990), “Tin whiskers: mechanisms of growth and prevention”,Proceedings of 4th International SAMPE Electronics Conference, June.

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