Solution-processable CF 3 -substituted ductile polyimides with low coefficients of thermal expansion as novel coating-type protective layers in flexible printed circuit boards-Reference-Cited by-同舟云学术

Solution-processable CF 3 -substituted ductile polyimides with low coefficients of thermal expansion as novel coating-type protective layers in flexible printed circuit boards

Published:2016-10 Issue: Volume:99 Page:125-133
ISSN:0300-9440
Container-title:Progress in Organic Coatings
language:en
Short-container-title:Progress in Organic Coatings

Author:

Ishii Junichi,Yokoyama Naoki,Hasegawa Masatoshi

Publisher

Elsevier BV

Subject

Materials Chemistry,Organic Chemistry,Surfaces, Coatings and Films,General Chemical Engineering

Reference27 articles.

1. Flexible Circuit Technology;Fjelstad,2007

2. Polyimides

3. M.I. Bessonov, M.M., Koton, V.V., Kudryavtsev, L.A. Laius (Eds), Polyimides: Thermally Stable Polymers, New York, 1987.

4. Polyamic Acid and Polyimides: Synthesis, Transformation and Structure,1993

5. Polyimides: Fundamentals and Applications,1996

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