1. A.Y. Xiao, Q.K. Tong, A.C. Savoca, R.L. Frentzel, M.C. Rendle, H. Van Oosten, in: Proceedings of the 50th Electronic Components and Technology Conference, 2000, p. 882.
2. H. Hirai, T. Motomura, O. Shimada, Y. Fukuoka, in: Proceedings of the International Symposium on Electronic Materials and Packaging (EMAP 2000), 2000, p. 1.
3. J.C. Jagt, in: Proceedings of the IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 21, No. 2, 1998, p. 215.
4. J. Liu, in: Proceedings of the First IEEE International Symposium on Polymeric Electronics Packaging, USA, 1997, p. 2, Microsyst. Technol. 5 (1998) 2, 72.
5. F. Lianhua, C. Tison, C.P. Wong, in: Proceedings of the Eighth International Symposium on Advanced Packaging Materials, p. 184.