Author:
Lee Hyunah,Cho Nam-Joo,Kim Dong-soo
Abstract
The double-layer blanket (DLB) reverse offset is a newly designed printing process for patterning electronic circuits on a 3D curved surface. Unlike the existing reverse offset process, the DLB reverse offset utilizes an offset roll composed of two layers comprising polydimethylsiloxane (PDMS) and a thick, soft cushioned rubber to print microelectrode patterns and transparent electrodes on a curved surface. The optimal printing process was determined by adjusting the printing pressure and printing speed for horizontal and vertical micropatterns, based on which transparent electrodes with metal mesh and honeycomb structures with a line width of 30 μm and pitch of 600 μm with micropatterns ranging from 30 μm to 60 μm were printed on a curved surface. Ag ink was used, and the 3D curved surface indicated a print quality similar to that of the flat surface for both the vertical and horizontal patterns and transparent electrodes. The DLB reverse offset technique demonstrated the possibility of printing on a 3D curved surface and is expected to broaden the range of printed electronics to applications such as smart glasses and 3D shape sensors.
Funder
National Research Foundation of Korea
Subject
Process Chemistry and Technology,Chemical Engineering (miscellaneous),Bioengineering
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