A study of adhesive improvement of a Cr–Ni alloy layer on a polyimide surface by low pressure gas plasma modification
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Organic Chemistry,Surfaces, Coatings and Films,General Chemical Engineering
Reference14 articles.
1. Flexible Circuit Technology;Fjelstad,1998
2. Surface modification of aromatic polyamide film by remote oxygen plasma
3. The thermal oxidation of AlGaAs
4. The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films
5. Tantalum, tantalum nitride, and chromium adhesion to polyimide: effect of annealing ambient on adhesion
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