Experimental and theoretical study of a vapour chamber based heat spreader for avionics applications
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference16 articles.
1. The experimental and numerical investigation of a grooved vapour chamber;Ming;Appl. Therm. Eng.,2009
2. Thermal characteristics evaluation for board-level high performance flip-chip package equipped with vapour chamber as heat spreader;Wang;Microelectron. Eng.,2010
3. Prediction of the maximum heat transfer capability of two-phase heat spreaders – experimental validation;Rullière;Int. J. Heat Mass Transf.,2007
4. Thermal performance of flat vapour chamber heat spreader;Hsieh;Energy Conv. Manag.,2008
5. Numerical analysis and experimental verification on thermal fluid phenomena in a vapour chamber;Koito;Appl. Therm. Eng.,2006
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