Thermal characteristics evaluation for board-level high performance flip-chip package equipped with vapor chamber as heat spreader-Reference-Cited by-同舟云学术

Thermal characteristics evaluation for board-level high performance flip-chip package equipped with vapor chamber as heat spreader

Published:2010-12 Issue:12 Volume:87 Page:2463-2467
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Wang Tong Hong,Lee Chang-Chi,Lai Yi-Shao

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

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2. L. Huang, M.S. El-Genk, Experimental investigation of transient operation of a water heat pipe, in: Proceedings of the 10th Symposium on Space Nuclear Power and Propulsion, Albuquerque, NM, USA, 1993, pp. 365–374.

3. W. Fan, C.K. Wong, Y.M. Tan, K.M. Chua, B. Freeman, H.J. Jiang, Design and fabrication of micro thermoelectric cooler on LTCC substrate, in: Proceedings of the 6th Electronics Packaging Technology Conference, Singapore, 2004, pp. 76–80.

4. X.C. Xuan, K.C. Ng, C. Yap, H.T. Chua, A two-stage cuboid-styled thermoelectric cooler with switched polarity, in: Proceedings of the 20th International Conference on Thermoelectrics, Beijing, China, 2001, pp. 444–447.

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